Purpose of ‘Equipotential Bonding’


Creative Commons License This work is licensed under a Creative Commons Attribution-NoDerivs 3.0 Unported License.

N.B. : This article is compiled…

Courtesy : EEP

Equipotential bonding is essentially an electrical connection maintaining various exposed conductive parts and extraneous conductive parts at substantially the same potential.

An earthed equipotential zone is one within which exposed conductive parts and extraneous conductive parts are maintained at substantially the same potential by bonding, such as that, under fault conditions, the difference in potential between simultaneously accessible exposed and extraneous conductive parts will not cause electric shock.

Bonding is the practice of connecting all accessible metalwork – whether associated with the electrical installation (known as exposed metalwork) or not (extraneous metalwork) – to the system earth.

In a building, there are typically a number of services other than electrical supply that employ metallic connections in their design. These include water piping, gas piping, HVAC ducting, and so on. A building may also contain steel structures in its construction. We have seen earlier in this chapter that when an earth fault takes place in an installation, the external conducting surfaces of the installation and the earth mass in the vicinity may attain higher potential with reference to the source earth.

There is thus a possibility that a dangerous potential may develop between the conducting parts of non-electrical systems including building structures and the external conducting parts of electrical installations as well as the surrounding earth.

This may give rise to undesirable current flow through paths that are not normally designed to carry current (such as joints in building structures) and also cause hazardous situations of indirect shock.

It is therefore necessary that all such parts are bonded to the electrical service earth point of the building to ensure safety of occupants. This is called equipotential bonding.

There are two aspects to equipotential bonding: the main bonding where services enter the building and supplementary bonding within rooms, particularly kitchens and bathrooms.

Full Article At : EEP

Advertisements

8 thoughts on “Purpose of ‘Equipotential Bonding’

  1. Pingback: SiteMap : Published Articles « Prerna Jain

  2. Pingback: Categorised List Of All Articles : « Prerna Jain

  3. Pingback: maggie sharma

  4. Pingback: SiteMap: Published Articles | E-Prerna.Com

  5. Pingback: SiteMap: Categorised List Of All Articles | E-Prerna.Com

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s